Low-cure Stress Adhesive Market

Low-cure Stress Adhesive Market Outlook (2024 to 2034)

The global low-cure stress adhesive market is calculated at a value of US$ 259.8 million in 2024, as revealed in the updated industry report published by Fact.MR. Worldwide sales of low-cure stress adhesives have been analyzed to increase at 3.9% CAGR and reach US$ 380.8 million by 2034-end. High requirement for sustainable and efficient bonding solutions in several industries are contributing to the rising sales of low-cure stress adhesives.

Expansion of the transportation, construction, and packaging industries driving up the demand for low-cure stress adhesives. Constant technological advancements and development in low-cure stress adhesive production techniques are also paving the way for suppliers in the global market. In recent years, an increase in the demand for silicone adhesives has been witnessed, which is further creating remunerative opportunities for low-cure stress adhesive manufacturers.

Aerospace, automotive, and electronics are industries that deal with sensitive components. Low-cure stress adhesives provide reduced thermal stress, which is crucial for these industries. Increasing demand for lightweight materials in the automotive industry is widening the application scope of adhesives for bonding materials effectively.

Growing focus on faster production procedures is driving demand for low-cure stress adhesives in several industries, especially automotive. These adhesives ensure quick curing times, thereby leading to improved production efficiency. This factor aligns with the industry requirements prioritizing rapid production without any compromise on the durability and quality of the bonded materials.

• Worldwide sales of low-cure stress adhesives for application in electro-optical systems are evaluated to rise at 4.3% CAGR and reach US$ 87.2 million by the end of 2034.
• Demand for low-cure stress adhesives in Japan is projected to accelerate at 3.6% CAGR from 2024 to 2034.
• East Asia is approximated to capture 23.6% share of the global market by 2034-end.

Report Attribute	Detail
Low-cure Stress Adhesive Market Size (2024E)	US$ 259.8 Million
Forecasted Market Value (2034F)	US$ 380.8 Million
Global Market Growth Rate (2024 to 2034)	3.9% CAGR
Market Share of Jars & Bottles Segment (2034F)	62.7%
North America Market Share (2034F)	9.1%
South Korea Market Growth Rate (2024 to 2034)	6.2% CAGR
Key Companies Profiled	Norland Products; Appli-Tec Inc.; Zymet; Chase Corporation; Nextgen Adhesives; United Adhesives; Dow; Toagosei Co Ltd; Dymax; Tex Year Industries Inc.; Henkel Corporation; Parson Adhesives Inc.; Inseto; Panacol-Elosol GmbH; Masterbond.

What is Complementing Low-cure Stress Adhesive Market Growth?

“Increasing Use of Low-cure Stress Adhesives in Packaging”

Industrial technologies have been evolving significantly in recent years. Low-stress adhesives are becoming popular for MEMS packaging among electronic device manufacturers. Moreover, various end-use industries, such as automation & robotics, consumer electronics, chemicals & petrochemicals, automotive, and others, use adhesives for component packaging. Thereby, there has been an increase in the demand for these adhesives for packaging purposes, which is further contributing to market expansion.

“Surging Popularity of Low-cure Stress Adhesives for their Specific Benefits”

Low-cure adhesives are becoming popular for their fast-curing features, which enhance production rates with minimal loss of adhesion. Fast curing, gap filling, thermal stability, high reliability, and chemical and moisture resistance features of low-cure stress adhesives lead to improved efficiency, which is further opening doors for manufacturing companies.

“Growing Requirements for Low-cure Stress Adhesives in Electronics Industry”

There is increased consumption of low-cure stress adhesives in the electronics industry. They are used for bonding SMCs (surface-mount components), potting, and wire tacking. Rising demand for electronics adhesives is contributing to increasing low-cure stress adhesive sales as compared to other substitute options such as thermal gap pads. Increasing requirements for electronics are stimulating manufacturers to reduce manufacturing and labor costs to increase their profit margins.

What is Limiting Sales Growth of Low-cure Stress Adhesives?

“Development of Low-cure Stress Adhesives Complicated Process”

Developing these adhesives with the required durability and strength for specific purposes is one of the key challenges of manufacturers. It is a delicate process to maintain adhesive properties and strike the right balance between adhesives. As such, constant R&D efforts are required for their production, which can be a tedious and complex process.

Country-wise Insights

Fact.MR, a market research and competitive intelligence provider, in its updated industry analysis, says that East Asia is calculated to occupy a share of 23.6% of the global market by the end of 2034. Rising demand for low-cure stress adhesives in the region is attributed to the presence of huge end-use industries such as electronics and automotive that need these substances in large quantities.

Which Low-cure Stress Adhesive Market Trends are Benefitting Suppliers in the United States?

“Emphasis on Developing Renewable Resources”

Attribute	United States
Market Value (2024E)	US$ 14.2 Million
Growth Rate (2024 to 2034)	6.1% CAGR
Projected Value (2034F)	US$ 25.5 Million

The United States is evaluated to hold 73.5% share of the market in North America by the end of 2034. An emphasis has been given in the country for developing renewable resources as a replacement for petroleum-based chemicals. In addition, an expansion of the construction, electronic, and automotive industries is also stimulating demand for these adhesives in the country.

What Makes China a Profitable Market for Low-cure Stress Adhesive Producers?

“Growing Demand for Electronic Devices and Expanding EV Sector Widening Application of Low-cure Stress Adhesives”

Attribute	China
Market Value (2024E)	US$ 33 Million
Growth Rate (2024 to 2034)	4.6% CAGR
Projected Value (2034F)	US$ 51.5 Million

China is forecasted to occupy 57.3% of the East Asian market share by 2034-end. Increased demand for adhesives in the country is due to the growing use of electronic devices, such as cell phones, laptops, and other electronic components. In addition, the rising demand for electric vehicles in the automotive industry contributes to the growing consumption of low-cure stress adhesives for bonding purposes.

Which Factors are Shaping the Market for Low-cure Stress Adhesives in Japan?

“High Consumption of Adhesives in Automotive Industry”

Attribute	Japan
Market Value (2024E)	US$ 18.1 Million
Growth Rate (2024 to 2034)	3.6% CAGR
Projected Value (2034F)	US$ 25.9 Million

Japan is analyzed to contribute 28.8% share of the market in East Asia by the end of 2034. The county is home to various automotive companies, such as Honda, Toyota, Subaru, Nissan, Mazda, Mitsubishi, and Daihatsu. In addition, there is also an increase in the demand for electric vehicles. Thereby, the well-established automotive industry in the country is generating demand for low-cure stress adhesives for their structural bonding strength. Adhesives are utilized for joining EV components and help in shielding powertrains from vibration and shock.

Category-wise Insights

Fact.MR, in its report, asserts that silicon adhesives are becoming more popular for their special properties, including fast curing process, flexibility, high reliability, and many more. They are consumed for effective sealing and bonding of glass materials.

Which Packaging is Used Prominently by Low-cure Stress Adhesive Manufacturers?

“Rising Use of Jars & Bottles for Packaging of Low-cure Stress Adhesives”

Attribute	Jars & Bottles
Segment Value (2024E)	US$ 164.9 Million
Growth Rate (2024 to 2034)	3.8% CAGR
Projected Value (2034F)	US$ 238.8 Million

Based on packaging, jars & bottles are approximated to capture 62.7% of the low-cure stress adhesive market share by the end of 2034. Increased use of jars & bottles for adhesive packaging is attributed to their ability to preserve them in dry conditions. They help in maintaining the recommended temperature range for adhesive storage.

Which Application of Low-cure Stress Adhesives Accounts for High Revenue Generation?

“Increasing Consumption of Adhesives for Electro-optical Systems”

Attribute	Electro-optical
Segment Value (2024E)	US$ 57.4 Million
Growth Rate (2024 to 2034)	4.3% CAGR
Projected Value (2034F)	US$ 87.2 Million

The electro-optical sector is evaluated to possess a share of 22.9% of the global market by 2034-end. Adhesives are used in electro-optical systems for their performance properties. Low-temperature curing, high strength, and gap filling are some of the properties of low-cure adhesives contributing to their use for dimensional thermal stability. These further ensure excellent attachment/alignment of electro-optic device components.

Competitive Landscape

New product development, management of supply chain systems, and offering quality products are some of the key initiatives taken by some of the key players in the low-cure stress adhesive market to gain a competitive edge. Market players are channeling their resources to plan, design, and offer adhesives for multiple applications.

For instance :

• Appli-Tech, in February 2021, delivered Appli-Thane 7300 adhesive material. These are best-in-class used for thermal conductivity.
• Dow, in May 2022, came up with the DOWSIL 6015, which is a thermally conductive encapsulant. It offers exceptional thermal management and self-adhesion for use in power electronics.
• Dymax is one of the key manufacturers of curing equipment and materials. In November 2021, the company introduced 9501-F structural bonding adhesives for use in electric vehicle batteries.

Fact.MR provides detailed information about the price points of key manufacturers of low-cure stress adhesives positioned across the world, sales growth, production capacity, and speculative technological expansion, in the recently updated market report.

Segmentation of Low-cure Stress Adhesive Market Research

• By Substrate :

  • Silicon
  • Glass
  • Metal
  • Others

• By Packaging :

  • Cans
  • Jars & Bottles
  • Cartridges
  • Syringes

• By Application :

  • Optical
  • Electro-optical
  • Electronic
  • Fiber-optics
  • Photonics
  • Others

• By End Use :

  • Consumer Electronics
  • Automation & Robotics
  • Healthcare & Medical Devices
  • Aerospace & Defense
  • Automation
  • Chemicals & Petrochemicals
  • Laboratory & Research
  • Others

• By Sales Channel :

  • OEMs
  • Aftermarket

• By Region :

  • North America
  • Latin America
  • Western Europe
  • Eastern Europe
  • East Asia
  • South Asia & Pacific
  • MEA