3D IC and 2.5D IC Market

3D IC and 2.5D IC Market Outlook (2024 to 2034)

According to the latest study released by Fact.MR, the global 3D IC and 2.5D IC market has been forecasted to rise from a size of US$ 22.1 billion in 2024 to US$ 129.12 billion by 2034-end. Demand is projected to increase at a remarkable CAGR of 19.3% from 2024 to 2034.

Integrated circuits that handle massive volumes of data and provide fast processing are becoming more necessary as applications in fields such as artificial intelligence, machine learning, and big data analysis are getting more complicated. These needs are being satisfied by the increasing bandwidth and lower latency provided by 3D and 2.5D ICs.

3D and 2.5D integrated circuits (ICs) allow the production of more versatile and powerful devices as they integrate several elements such as memory, logic, sensors, and others in a single device. Due to this capability, they are increasingly used in advanced applications in industries such as consumer electronics, automotive, and telecommunication.

Key Market Growth Drivers

• Continuously increasing demand for higher computational power and quicker processing speed is contributing to the 3D IC and 2.5D IC market size expansion.
• 3D and 2.5D integrated circuits provide the option of packing more functionality into a smaller package, facilitating the creation of high-performance computing systems for data centers, artificial intelligence (AI), and cutting-edge mobile devices.
• A Key 3D IC and 2.5D IC market trend is increasing focus on creating smaller and more compact electronic products such as wearables, smartphones, and Internet of Things devices, further creating prospects for companies.
• By stacking several layers of integrated circuits, 3D and 2.5D IC technologies increase functionality and performance while taking up less space.
• To improve energy efficiency, 3D and 2.5D integrated circuits shorten the distance that signals need to travel within a chip.
• 3D and 2.5D ICs reduce power consumption and heat generation for applications where energy efficiency is a top priority such as mobile devices and data centers.
• Production of 3D and 2.5 integrated circuits is becoming more practical and affordable due to technological advancements in semiconductor manufacturing such as through-silicon vias (TSVs) and enhanced packaging methods.

Report Attribute	Detail
3D IC and 2.5D IC Market Size (2024E)	US$ 22.1 Billion
Forecasted Market Value (2034F)	US$ 129.12 Billion
Global Market Growth Rate (2024 to 2034)	19.3% CAGR
East Asia Market Share (2024E)	32.5%
North America Market Value (2024E)	US$ 5.86 Billion
3D Wafer-Level Chip-Scale Packaging Segment Value (2034F)	US$ 67.66 Billion
Consumer Electronics Segment Value (2034F)	US$ 33.7 Billion
Key Companies Profiled	Samsung Electronics; Texas Instruments Inc.; JCET Group Co., Ltd.; ASE Technology Holding Co., Ltd.,; Amkor Technology; Taiwan Semiconductor Manufacturing Company; Intel Corporation; Toshiba Corp.; Broadcom Ltd.; Jiangsu Changjiang Electronics Technology Co., Ltd.; United Microelectronics Corp.; Siemens AG.

What Factors are Contributing to Increasing Demand for 3D and 2.5D ICs?

“Enhancing Processing Capabilities Through Multi-Layer Circuit Stacking”

The use of 3D and 2.5D integrated circuits is increasing due to the rising need for high-performance computing, as these technologies allow the integration of more functionality in smaller packages. 3D and 2.5D ICs provide an effective solution as applications such as artificial intelligence (AI), data centers, and advanced mobile devices need higher computational power and faster processing rates.

3D and 2.5D integrated circuits maximize processing power while reducing physical dimensions, which makes them perfect for high-performance systems that need to be both powerful and small. Their prominence in the latest computing applications is being driven by their capacity to provide greater performance in a reduced form factor.

What is a Key Challenge for 3D and 2.5D Integrated Circuit Manufacturers?

“High Complexity Compared to Previous Chips Due to Multi-Layered Architecture”

3D and 2.5D integrated circuits are considered more complex in design than normal 2D chips due to their multi-layered architecture and the need to handle interconnections between multiple layers or components. This level of complexity necessitates advanced design tools and specific knowledge to make sure that the chips work properly and efficiently, this factor is somehow hampering the 3D IC and 2.5 IC market growth.

The complex structure of these designs regularly needs lengthier development cycles, which raise both the time and expense of introducing new items to the market. These obstacles are hindering innovation and making it more difficult for companies to introduce new 3D and 2.5D IC products quickly.

Country-wise Insights

Demand for 3D and 2.5D ICs is increasing in the North American region due to rising requirements in industries such as data centers, telecommunications, and consumer electronics. Another factor contributing to the market expansion in the region is the increasing utilization of the latest technologies such as AI, machine learning, and IoT, which is generating the need for high-performance processors.

East Asia is projected to lead with 32.5% of the worldwide 3D IC and 2.5D IC market share in 2024 and is further projected to hold 34.4% by the end of 2034 due to well-established consumer electronics and semiconductor industries.

What Makes the United States Lucrative Market for 3D ICs and 2.5D IC Providers?

“Leadership in Artificial Intelligence, Data Centers, and Cloud Computing”

Attribute	United States
Market Value (2024E)	US$ 4.11 Billion
Growth Rate (2024 to 2034)	20.4% CAGR
Projected Value (2034F)	US$ 26.31 Billion

Demand for high-performance computing solutions increasing in the United States due to leadership in the industries such as cloud computing, artificial intelligence (AI), and data centers. In these applications, 3D and 2.5D integrated circuits (ICs) are essential because they offer quicker processing rates, increased bandwidth, and better power efficiency. The management of the huge quantities of data processing and complex calculations needed in these industries is possible with these ICs.

Innovative technologies that depend on high-performance computing capabilities are supported in their growth and innovation by 3D and 2.5D integrated circuits (ICs), which make computing more powerful and efficient.

How is the Market Progressing in Japan?

“Key Role in Consumer Electronics Miniaturization and Performance Enhancement”

Attribute	Japan
Market Value (2024E)	US$ 1.66 Billion
Growth Rate (2024 to 2034)	20.5% CAGR
Projected Value (2034F)	US$ 10.75 Billion

The growing demand for advanced yet high-performing and smaller gadgets such as smartphones, wearables, and smart devices in Japan is a key factor behind the increasing demand for 3D and 2.5D ICs. This ongoing progress in the country is facilitated by the integration of additional functions into smaller, more compact form components made by 3D and 2.5D ICs.

Latest consumer electronics are continuously changing, and these advanced integrated circuits are enabling improved performance and functionality in constrained spaces.

Category-wise Insights

Based on the application, the market is segmented into logic, imaging & optoelectronics, memory, micro-electromechanical systems/sensors, light-emitting diode, power, analog & mixed signal, radio frequency, and photonics. The logic segment is projected to hold a significant market share over the next ten years due to the increasing number of smart city projects in several countries and the rising demand for high-performing access control systems.

Why is the Preference for 3D Wafer-Level Chip-Scale Packaging High?

“Manufacturers Finding WLCSP Ideal Solution to Make Powerful and Small Advanced Devices”

Attribute	3D Wafer-Level Chip-Scale Packaging
Segment Value (2024E)	US$ 11.96 Billion
Growth Rate (2024 to 2034)	18.4% CAGR
Projected Value (2034F)	US$ 67.66 Billion

In the market, there is increasing demand for 3D wafer-level chip-scale packaging (WLCSP) due to its several benefits such as downsizing, performance, and cost-effectiveness. The integration of several circuit layers into a small space is possible by 3D WLCSP, which makes it possible to create electrical devices that are more powerful and smaller.

The 3D wafer-level chip-scale packaging approach increases overall device performance, minimizes latency, and improves signal integrity by decreasing the distance between components. 3D WLCSP is considered more affordable in large quantities, which makes it an ideal choice for producers who want to provide advanced and high-performing products with controllable manufacturing expenditures.

Why is the Utilization of 3D and 2.5D ICs increasing in the Consumer Electronic Industry?

“Enhancing Performance and Reducing Power Consumption in Consumer Electronics”

Attribute	Consumer Electronics
Segment Value (2024E)	US$ 5.99 Billion
Growth Rate (2024 to 2034)	20% CAGR
Projected Value (2034F)	US$ 33.7 Billion

The utilization of 3D and 2.5D IC technologies is increasing in the consumer electronic industry as it is helping to improve performance, lower power consumption, and facilitate downsizing. The development of small and high-performance gadgets such as smartphones, tablets, and wearables depends on the ability to fit more components into smaller spaces, which is possible by these integrated circuits.

3D and 2.5D integrated circuits are increasing processing speed and efficiency by stacking layers of circuitry or merging several chips into a single package, satisfying the growing need for faster, more powerful consumer devices. These technologies are also contributing to longer battery life, which is important for portable device users.

Competitive Landscape

Key players in the 3D IC and 2.5D IC market are investing in R&D activities to make further advancements in technology. These ongoing innovations include materials, manufacturing processes, design, and others, for enhancing performance, reducing expenditures, and creating advanced products.

• In July 2024, new software for the planning and heterogeneous integration of ASICs and chiplets using the new substrates and 2.5D and 3D semiconductor packaging methods was introduced by Siemens Digital Industries Software.
• In October 2023, leading worldwide semiconductor foundry United Microelectronics Corporation said that to assist clients in expediting the production of their 3D products, it launched the W2W (wafer-to-wafer) 3D IC project in association with partners ASE, Faraday, Winbond, and Cadence.

Fact.MR provides detailed information about the price points of prominent companies of 3D ICs and 2.5D ICs positioned across the world, sales growth, production capacity, and speculative technological expansion, in this new market report.

Segmentation of 3D IC and 2.5D IC Market Research

• By Packaging Technology :

  • 3D Wafer-Level Chip-Scale Packaging
  • 3D Through-Silicon Via
  • 2.5D

• By Application :

  • Logic
  • Imaging & Optoelectronics
  • Memory
  • Micro-Electromechanical Systems/Sensors
  • Light-Emitting Diode
  • Power
  • Analog & Mixed Signal
  • Radio Frequency
  • Photonics

• By End User :

  • Consumer Electronics
  • Telecommunication
  • Industry Sector
  • Automotive
  • Military & Aerospace
  • Smart Technologies
  • Medical Devices

• By Region :

  • North America
  • Western Europe
  • Eastern Europe
  • Latin America
  • East Asia
  • South Asia & Pacific
  • Middle East & Africa